High power LED lamp heat dissipation performance factors
2022-12-08
LED lights have features such as energy saving and environmental protection, but the actual operation process is easy to generate a lot of heat, once the heat can not be discharged, it is easy to have a high temperature resulting in abnormal chip heat, light source decline and reduced lamp life, etc. In simple terms, the LED lamp thermal management structure is mainly chip-level sealing, packaging level and system integration thermal level.
High power LED lamp thermal performance factors:
1, fin geometric parameters
In general, high-power LEDs and other changes in fin parameters will directly affect the thermal performance, showing a positive correlation. Before reaching the rated value, high-power LED lamps and lanterns fin thickness, height, spacing, number, length increase will trigger an increase in heat dissipation efficiency, the upper surface layer of a fin heat dissipation effect is significantly lower than the four side fin scattering thermal effect.
2, the impact of external temperature
High-power LED lamp work process will appear a large amount of heat, this heat needs to be discharged in a timely manner, so the outside temperature and high-power LED lamp temperature gap is large, easy to discharge heat, and vice versa when the outside temperature and high-power LED lamp temperature gap is not large, will affect the LED lamp heat dissipation, this temperature impact is limited, but for LED and other optimal heat dissipation efficiency is a great impact .
3, the LED lamp heat dissipation materials
High-power LED and other heat dissipation material selection on the impact of heat dissipation is relatively obvious, generally in the natural state, the use of good performance, good thermal conductivity of the material for heat dissipation, LED and other heat dissipation efficiency will be higher, and for the thermal radiation heat dissipation method requires the selection of specialized materials.
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High power LED lamp heat dissipation performance factors
LED lights have features such as energy saving and environmental protection, but the actual operation process is easy to generate a lot of heat, once the heat can not be discharged, it is easy to have a high temperature resulting in abnormal chip heat, light source decline and reduced lamp life, etc. In simple terms, the LED lamp thermal management structure is mainly chip-level sealing, packaging level and system integration thermal level.
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